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WE OFFER LEAD FREE PROCESS
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1021 Meyerside Drive
Unit #2
Mississauga, ON
L5T1J6
CANADA
Phone: (905) 564-7750
Fax: (905) 564-7713
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Circuit Board Assembly
At Bramtronics we understand the needs of our clients, that's why we
offer fast turn around, guaranteed quality, very competitive rates.
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Surface Mount Technologies - [Click Here]
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Our capabilities include:
- Placing packages as small as 0402
- BGA, SOIC, PLCC, QFP Packages
- Ultra fine pitch as small as 0.015"
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We're able to work with components in different packaging forms:
- Tape & Reel
- Tubes
- Matrix Trays
- Bulk
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Through Hole Assembly - [Click Here]
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We're able to accommmodate you whether you need just the surface mount components
placed, just the through hole, or both!
- Axial Insertion
- Radial Insertion
- Dip
- Wire Leads
- Connectors
- Hand Assembly of odd parts
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High Volume Production - [Click Here]
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Our capabilities include:
- High Speed Component Placers - Each able to place up to
24000 parts per hour, a combined total of 700000 parts
per day.
- Automatic and Semi-Automatic Printers - Our printers have optical
features, which increases the precision of the solder paste placement
and reduces the need for repair.
- Convection Reflow Oven - Our multi-zone oven is capable of handling
a high volume of boards and the versatility to precisely control temperature
profiles to cater to each board individually.
- Electrovert Wave Solder Machine - Our Electrovert wave solder
machine is equipped with top and bottom infra red heaters and dual solder
pumps. These features allow us to accurately wave solder all forms of thru hole
and surface mount parts. We are also equipped to use water soluable and no clean
fluxes.
- X-Ray inspection unit - After population of BGA packages, X-Ray Inspection
is performed to ensure proper solder adhearson and accurate placement.
- Automated Optical Inspection Unit - Able to inspect packages as small as
0402, inspects for proper solder joints, correct parts, orientation and other
factors that affect the quality of your product.
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